GT04 Series

  • Meets Updated IEC Standards
  • Compact Through-Hole
  • 12.2 mm Creepage
  • ET Product : Up to 378Vμs
  • Hi-Pot : 4500 VDC
  • Drive Ind.: 39 - 8910 μH
  • Lkg Ind.: 3.50 μH Max

GT06 Series

  • Meets Updated IEC Standards
  • Meets AEC-Q200 Standard
  • 12.5mm Creepage
  • ET Product: Up to 142Vμs
  • Hi-Pot: Up to 4000 VAC
  • Drive Ind.: 95 - 2000 μH
  • Lkg Ind.: 2.40 μH Max

GT07 Series

  • Meets Updated IEC Standards
  • 9.2 mm Creepage
  • ET Product: Up to 60Vμs
  • Hi-Pot: Up to 6250 VAC
  • Drive Ind.: 100 - 480 μH
  • Lkg Ind.: 0.80 μH Max

GT02 Series

  • Low Profile
  • ET Product: Up to 19.4Vμs
  • Hi-Pot: 1500 VDC
  • Drive Ind.: 21.6 - 785 μH
  • Lkg Ind.: 0.20 μH Max

GT03 Series

  • ET Product: Up to 110Vμs
  • Hi-Pot: 3750 VDC
  • Drive Ind.: 162 - 5100 μH
  • Lkg Ind.: 0.55 μH Max

GT17005

  • 9.2 mm Creepage
  • ET Product: 70.6 V-μs
  • Hi-Pot: 3750 VAC
  • Drive Ind.: 50 μH Min
  • Lkg Ind.: 0.50 μH Max

XT Series

  • Small Size
  • ET Product: Up to 12.8Vμs
  • Hi-Pot: 2350 VDC
  • Drive Ind.: 31 - 140 μH Min
  • Lkg Ind.: 0.60 μH Max

Technical Highlights

  • Galvanic isolation between control and power stages
  • Designed for MOSFET, IGBT, SiC, and GaN gate drive circuits
  • Optimized volt-second (ET) capability for accurate pulse transfer
  • Low leakage inductance and tight magnetic coupling
  • Wide switching frequency support (tens of kHz to MHz range, depending on series)
  • High isolation ratings up to multi-kV (AC/DC depending on series)
  • Reinforced creepage and clearance options for industrial and automotive designs
  • Available in SMT (low-profile) and through-hole packages
  • AEC-Q200 qualified options for automotive applications
  • UL 94V-0 compliant materials

Typical Applications

  • Isolated high-side and low-side gate drive circuits
  • DC-DC converters and AC-DC power supplies
  • Half-bridge, full-bridge, and push-pull topologies
  • Industrial motor drives and inverters
  • Renewable energy inverters (solar, ESS)
  • Automotive power electronics and EV systems
  • Telecom and data center power modules
  • Wide-bandgap (SiC/GaN) switching systems
  • Isolated bias supplies for gate driver ICs
Part Number Drive Inductance (μH, Min) Turns Ratio (Pri:Sec1:Sec2) DCR (mΩ, Max) ET Product (V-μs, Max) Leakage Inductance (nH, Min) SRF (MHz,Typ) Hi Pot (Drive:Gate)(Vdc) Length (mm, Max) Width (mm, Max) Height (mm, Max) Creepage (mm, Min) Mounting Type Pick & Place TI Product Compatibility Infineon Product Compatibility Samples Availability Mouser Availability
GT02-110-006 Sample 135 1:1 228:45:00 6.9 200 13.3 1500 8.60 6.80 --- SMD green-circle-tick --- --- green-circle-tick green-circle-tick green-circle-tick
GT02-110-006 Sample 136 1:1 228:45:00 10.2 400 13.3 1500 8.60 6.80 --- SMD green-circle-tick --- --- green-circle-tick green-circle-tick green-circle-tick
GT02-110-008 Sample 135 1:1 228:45:00 19.4 500 13.3 1500 8.60 6.80 --- SMD green-circle-tick --- --- green-circle-tick green-circle-tick green-circle-tick
GT02-110-006 Sample 135 1:1 228:45:00 34.6 600 13.3 1500 8.60 6.80 --- SMD green-circle-tick --- --- green-circle-tick green-circle-tick green-circle-tick
GT02-110-014 Sample 135 1:1 228:45:00 12.8 800 13.3 1500 8.60 6.80 --- SMD green-circle-tick --- --- green-circle-tick green-circle-tick green-circle-tick
GT02-110-019 Sample 138 1:1 228:45:00 70.6 200 13.3 1500 8.60 6.80 --- SMD green-circle-tick --- --- green-circle-tick green-circle-tick green-circle-tick
GT02-110-010 Sample 140 1:1 228:45:00 6.9 200 13.3 1500 8.60 6.80 --- SMD green-circle-tick --- --- green-circle-tick green-circle-tick green-circle-tick

Custom Solutions & Capabilities

ICE designs and manufactures custom gate drive transformers tailored for specific switching topologies, voltage isolation requirements, and semiconductor technologies including MOSFET, IGBT, SiC, and GaN devices. Our engineering team can optimize turns ratio, volt-second (ET) capability, leakage inductance, creepage/clearance distances, and insulation systems to meet reinforced isolation and regulatory requirements.

We support custom SMT and through-hole designs for half-bridge, full-bridge, push-pull, and multi-channel gate drive architectures. Whether you require higher isolation ratings, improved common-mode noise immunity, or footprint optimization for high-density layouts, ICE provides application-specific magnetic solutions from prototype through production.

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Frequently Asked Questions (FAQs)

How do I calculate the required volt-second (ET) product for my gate drive transformer?

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The required ET value is determined by the applied gate drive voltage and maximum pulse width. ET must be greater than or equal to V × t(on) to prevent core saturation.

What causes pulse distortion in gate drive transformers?

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Insufficient magnetizing inductance, excessive leakage inductance, or core saturation can distort the gate waveform and increase switching losses.

Can gate drive transformers support duty cycles above 50%?

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Higher duty cycles may require reset techniques or specific transformer configurations to prevent flux walking and saturation.

How does leakage inductance affect switching performance?

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Higher leakage inductance slows gate transitions and may introduce ringing, reducing efficiency and increasing EMI.

When should I choose a gate drive transformer over an optocoupler?

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Gate drive transformers are preferred in high dV/dt environments requiring fast pulse transfer and strong common-mode immunity.

What limits the maximum switching frequency?

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Core material losses, magnetizing inductance, and winding parasitics define the usable frequency range.

How does creepage distance influence reliability?

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Adequate creepage ensures long-term insulation integrity under high-voltage stress and contamination conditions.

Can these drive SiC and GaN devices?

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Yes, if designed to support fast edge rates and controlled leakage inductance required by wide-bandgap devices.

What happens if the core saturates?

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Saturation results in waveform collapse, excessive current draw, and potential gate driver damage.

How do I minimize ringing in gate drive circuits?

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Optimize leakage inductance, PCB layout parasitics, and gate resistor selection.