| Part Number | Drive Inductance (μH, Min) | Turns Ratio (Pri:Sec1:Sec2) | DCR (mΩ, Max) | ET Product (V-μs, Max) | Leakage Inductance (nH, Min) | SRF (MHz,Typ) | Hi Pot (Drive:Gate)(Vdc) | Length (mm, Max) | Width (mm, Max) | Height (mm, Max) | Creepage (mm, Min) | Mounting Type | Pick & Place | TI Product Compatibility | Infineon Product Compatibility | Samples Availability | Mouser Availability |
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ICE designs custom surface-mount high current inductors optimized for compact, high-density PCB layouts and modern high-frequency switching converters. Our engineering team can tailor inductance values, saturation current ratings, core materials, shielding characteristics, and DCR performance to meet efficiency and thermal targets.
We support magnetically shielded designs, ultra-low profile constructions, and high-current SMT solutions exceeding standard catalog ratings. From prototype evaluation to volume production, ICE delivers application-specific inductors engineered for VRMs, POL converters, and high-performance DC-DC power stages.
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Shielding contains flux within the core structure.
Core saturation and copper temperature rise.
They reduce PCB height and improve airflow.
Excess ripple increases heating and accelerates insulation aging.
Hysteresis and eddy current losses.
Yes, if thermal and current ratings are sufficient.
Measured at zero DC bias under specified test frequency.
Copper planes improve thermal dissipation.
Frequency where inductive reactance equals parasitic capacitance.
Yes, designed for reflow soldering and pick-and-place.
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